split optics

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The HFB-System in Configuration Opto with the lowest bond forces for sensitive components and with the proven beam splitter optics is the next member of the Paroteq semi automatic die bonder family.
Be it for lower volume production or for R&D purposes this stand alone semi-automatic pick-and-place die bonder offers quick results yet with high placement accuracy. This arrangement guarantees a maximum of process stability as well as a maximum working range using minimal footprint.

  • Bond force 5-500cN
  • Second Z - axis
  • HMTPA (high magnified two point alignment)
  • Network ready (RDS)
  • Cycle time <5 sec.

Events

  • no dates available
 

Products

 

H-System - Die Bonder platform

Pick-and-place system with dispenser and heating plate
Pick-and-place system with dispenser and heating plate
Dispenser and heating plate on the H-System
Dispenser and heating plate on the H-System
Heating plate
Stage with heating plate 25x25 and mounting for 4x wafflepack
Semi-automatic Die Bonder-System in overhead gantry arrangement with integrated beam splitter optics for accurate alignment.

Highlights:


The H-system is a versatile pick-and-place system in overhead gantry arrangement with integrated beam splitter optics. This arrangement ensures a maximum working range by minimal footprint as a desktop device. The integrated beam splitter optics for real time-image overlays allows the operator an intuitive and accurate alignment of component and substrate by means of micrometer screws. The programming of the Z-axis for different bond altitudes guarantees a reproducible connecting process. A second Z-axis can be used for load or unload of single or bonded devices, dispensing, dipping or stamping without tool exchange. Integrated heating plates, heated pick up tools or dispenser support the respective bond process. The H-system supports all topical and future connecting technologies and applications in the area of micro systems technology.

Applications

  • Die Bonding
  • Flip Chip Bonding
  • CoS (chip on Submount)
  • MEMS / MOEMS assembly
  • sensor assembly
  • assembly of optical components (photo diodes, laser diodes)
  • assembly of lenses and lens arrays
  • Laser bar bonding
  • assembly of mechanical components
  • sorting of components
  • assembly of medical parts

Technologies

  • thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding)
  • ultrasonic - or thermosonic bonding
  • adhesive bonding
  • dispensing
  • dipping
  • stamping
  • UV curing

Options

  • HMTPA (high magnified two point alignment)
  • different light sources
  • dispensing / stamping
  • UV-curing
  • heated pick up tools
  • heating plates with and w/o vacuum structure
  • Coplanarity tools
  • process gas chamber
  • process gas suction
  • support plate with vacuum
  • input-/output station with or without vacuum
  • HD inspection camera

Technical specifications

  • Overhead gantry arrangement
  • beam splitter optics
  • HD camera with optical zoom
  • fully programmable bond process
  • micrometer screws for x- and y-axis
  • height adjustable bond stage
  • bond force: 10 - 500cN
  • positioning accuracy: 5 micron
  • maximum component size:
    25 mm x 25 mm
  • maximum substrate size:
    300 mm x 300 mm
  • working area:
    300 mm x 240 mm

Downloads

Broshure

H-System
 
 

HFB-System High Flexible Die Bonder System

HFB-System
Pick-and-place system with high force capability
air cushion table on HFB-System
Air cushion table on HFB-System
Dispenser on HFB-System
Dispenser on HFB-System
Semi-automatic Die Bonder-System in rigid granite frame arrangement with a high bond force capability, second z - axis and a beam splitter optics for accurate alignment.

Highlights:


The HFB-System is a versatile Die Bonder-System designed for micro assembly applications like diffusion bonding or high contact density flip chip bonding. With the integrated dual imaging optics in combination with the programmable Z-axis this system is well suited for reproducible bonding of electronic and opto-electronic components. A physically generated overlay live image allows the operator in combination with a user friendly program interface to intuitively perform the component alignment and bonding. A second Z-axis can be used for load or unload of single or bonded devices, dispensing, dipping or stamping without tool exchange. This arrangement guarantees a maximum of stability at high bond forces as well as a maximum working range using minimal footprint. Available options such as different heating plates, heated pick up tools, ultrasonic module or dispenser further extend the usability of the system. The HFB-system supports all topical and future connecting technologies and applications in the area of micro systems technology.

Applications

  • sinter / diffusion bonding
  • high contact density Flip Chip Bonding
  • CoS (chip on Submount)
  • MEMS / MOEMS assembly
  • sensor assembly
  • assembly of optical components (photo diodes, laser diodes)
  • assembly of lenses and lens arrays
  • laserbar bonding
  • wafer bonding
  • assembly of mechanical components
  • sorting of components
  • assembly of medical parts

Technologies

  • thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding, Cu/Cu bonding)
  • ultrasonic - or thermosonic bonding
  • adhesive bonding
  • dispensing
  • dipping
  • stamping
  • UV curing

Options

  • HMTPA (high magnified two point alignment)
  • different light sources
  • ultrasonic module
  • dispensing / stamping
  • UV-curing
  • heated pick-up tools
  • heating plates with and w/o vacuum structure
  • Coplanarity tools
  • process gas chamber
  • process gas suction
  • support plate with vacuum
  • input-/output station with or without vacuum
  • HD inspection camera

Technical specifications

  • rigid granite frame arrangement
  • beam splitter optics
  • fully programmable bond process
  • air cushion table with micrometer screws for x- and y-axis
  • levelable and height adjustable bond stage
  • HD camera with optical zoom
  • bond force: 0.1 - 1000N
  • positioning accuracy: 3 micron
  • maximum component size 25mm x 25mm
  • maximum substrate size 175mm x 175mm
  • working area: 175mm x 150mm
  • open frame for process gas suction

Downloads

 

Modules

 

Operating System

Traceability
Traceability
Control
Control
Connectivity
Connectivity
Intuitive operating system for continuous process control and traceability with connection to your data system.

Highlights:

  • freely programmable machine processes
  • recipe based management of process parameters
  • storage of process parameters and component data
  • remote service and control via LAN
  • flexible data import and export via ftp
  • component tracking
  • different operator level for repeatable work flow
  • same software on all Paroteq systems
Paroteq systems are supplied as plug-in solutions and are ready for use within a very short time. This includes all components for controlling and supplying the motion and process units and an interface for data transmission and maintenance. Our operating system is based on an intuitive GUI and allows simple parameterization of the assembly process and reproducible production.

Pick up tools

Pick-up tools
Pick-up tools
Coplanarity tool
Coplanarity tool
Tab bond tool mit Parallelit㳳ausgleich, Dimension: 25 mm x 2 mm
Tab bond tool , Dimension: 25 mm x 2 mm
Component-saving placement with coplanarity adjustment and dynamic heater.

For the assembly of various components in the fields of mechanics, electronics and optoelectronics Paroteq provides assembly tools which are optimally adapted to the particular application. These tools use passive coplanarity adjustment to ensure a coplanar assembly.

Technical specifications

  • up to 50k/S
  • up to 450 C
  • coplanarity adjustment for component-saving placement
  • thermocouple type K or PT100
  • any vacuum structure
  • shaft diameter: 3 - 6 mm

Applications

  • Die bonding
  • Laser bar bonding
  • MEMS / MOEMS assembly
  • Sensor assembly
  • Assembly of optical components

Technologies

  • Thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding
  • Adhesive bonding

Dynamic heaters

Heated pick-up tool with rapid cooling
Heated pick-up tool with rapid cooling
Heating plate with cover and tray support
Heating plate with cover and tray support
Heating plate 25x25 with tray support
Heating plate 25x25 with tray support
Dynamic heaters for micro assembly

For bonding of the mounted components Paroteq offers heaters for pick-up tools and heating plates which ensure a reproducible compliance of particular bonding parameters by their dynamic heating characteristics. Moreover their low thermal mass guarantees a reduction of the heat input into the assembly system.

Technical specifications

  • up to 50k/S
  • up to 450 C
  • active cooling
  • 10mm height adjustment
  • thermocouple type K or PT100
  • any vacuum structure

Options

  • shielding gas chamber for heating plate
  • flow meter for shielding gas chamber 1-10 LPM
  • mechanical component clamping
  • vacuum clamping
  • additional vacuum for flexible substrates
  • temperature profiles with ramps

Applications

  • Die Bonding
  • MEMS / MOEMS assembly
  • Sensor assembly
  • Assembly of optical components

Technologies

  • Thermo-compression bonding (Eutectic bonding, Au/Au bonding, Au/Sn bonding)
  • Adhesive bonding

Quality assurance

 
Glass scale at coaxial lighting (detail view)
Glass scale at coaxial lighting (overview)
Universally applicable glass scales for quality assurance and adjustment of manual and automatical, imaging microsystems with a resolution of 0,5 - 10 m

Testing and adjusting

Our glass scales allow precise statements about the assembly accuracy of pick-and-place systems. Moreover the glass scales can be used to check the accuracy of image processing systems (PRS - pattern recognition system) on automatic assembly systems.

Technical specifications

  • 6 mm x 8 mm x 0,5 mm (bottom)
  • 5 mm x 4 mm x 0,5 mm (top)
  • 0,5 - 10 m resolution on one scale
  • opaque chrome structure in transparent environment

Applications

  • for testing and adjustment of the positioning accuracy of micro systems ( e.g. pick-and-place machines for chip adjustment)
  • checking of positioning systems with image processing ( PRS, pattern recognition system)
  • Machine capability studies (CMK)

Accessories

  • vacuum pick-up tool
  • vacuum suction plate
 

Services

 

Entwicklungsdienstleistungen

SolidWorks
SolidWorks
CX Programmer
CX Programmer
NB-Designer
NB-Designer
Paroteq unterstützt Sie bei der Entwicklung und Konstruktion von neuen Produkten.

Highlights:

  • 3D-Modellierung (Solid Works)
  • Dokumentation 2D-CAD- Montagezeichnungen (Solid Works)
  • SPS Programmierung (Omron)
  • Visualisierung (Omron)
Unser Leistungsumfang erstreckt sich über die gesamte Entwicklungsphase neuer Maschinen und Anlagen. Vom Modellieren erster Ideen im 3D-System bis zum Erstellen von 2D-Fertigungsunterlagen oder dem Programmieren von Programmabläufen bis zur Visualisierung der Prozess-Parameter.
 

Company

 

What we do

Paroteq GmbH is an innovative developer of high quality handling and automation solutions from the area of micro assembly.
We provide our customers with individual and application-oriented systems and tools for precision processes such as flip chip bonding or die bonding. As a company with international expertise in the field of micro assembly we develop and produce semiautomatic positioning and bond systems, modules for optical alignment, heating systems for thermo compression bonding as well as a wide range of pick-up tools for component handling in micro system technology.
As a result of combining our modules and subsystems we create individual bond systems, which can be used for engineering, prototype construction and production in the fields of electronics, optoelectronics, medical and micro systems technology.

Career

Paroteq ist ein Unternehmen aus dem Bereich der Entwicklung und Fertigung von Sondermaschinen für Mikromontage -Applikationen mit Sitz in Hennigsdorf bei Berlin. Zu unseren Leistungen gehören der gesamte Entwicklungsprozess der Geräte von der Entwicklung bis zur Montage und die kunden- und anwendungsspezifische Anpassung der Geräte sowie die Entwicklung und den Verkauf von hochwertigem Zubehörequipment.
Zur Verstärkung unseres Teams bieten wir zum nächstmöglichen Zeitpunkt qualifizierte und zuverlässige Mitarbeiter in den Positionen:

Studentischer Mitarbeiter (m/w) aus dem Bereich Mechatronik


  • Gute Kenntnisse im Umgang mit SolidWorks
  • Kenntnise der SPS-Programmierung
  • Gute handwerkliche Fähigkeiten für Herstellung und Montage der Geräte
  • Grundkenntnisse der Elektrotechnik
  • Gute Englisch-Kenntnisse
  • Strukturierte Arbeitsweise, Aufgeschlossenheit und ein freundliches Wesen

Industriemechaniker (m/w)


Was Sie erwartet:

  • Herstellen von Produktionsanlagen der Mikrosystemtechnik
  • Baugruppenmontage, Verdrahtung und Inbetriebnahme
  • Einrichten und Einstellen von Maschinen und Systemen
  • Durchführen von Qualitätskontrollen
  • Fräsen, Drehen, Bohren

Was Sie mitbringen sollten:

  • Abgeschlossene Berufsausbildung als Industriemechaniker (m/w)
  • Strukturierte, selbstätige Arbeitsweise, Aufgeschlossenheit und ein freundliches Wesen
  • Erfahrungen in der Feingerätetechnik wünschenswert, aber nicht zwingend erforderlich
  • Freude an der Arbeit im Team
Was wir bieten:

  • Ein freundliches und kreatives Arbeitsklima in einem jungen Unternehmen
  • Gemeinsame Arbeit an Projekten statt isolierter Beschäftigung
  • Flexible Arbeitszeiten (auch an Wochenenden möglich)
  • Abwechslungsreiche Tätigkeiten
  • Eine angemessene Vergütung
Haben wir Ihr Interesse geweckt? Dann schicken Sie uns Ihre vollständiigen Bewerbungsunterlagen bitte an mechatroniker@paroteq.de.
 

Imprint

disclosures in 5(1) N0. 1,2 Telemedia Act

Responsible for content:
Paroteq GmbH

Represented by:
CEO: Udo Hartwig

Contact:
Walter-Kleinow-Ring 7A
16761 Hennigsdorf (bei Berlin)
Deutschland
Telefon: +49 (0)3302 8982901
E-Mail: info@paroteq.de
http://www.paroteq.de

USt-IdNr.: DE295628812
Handelsregisternr.: HRB.10746 NP

Disclaimer

All due precautions and efforts were taken in the compilation of this website in order to keep the information contained as current, correct and clear as possible. Despite the greatest diligence unintentional misinformation cannot be ruled out. Paroteq therefore refuse any responsibility especially for typing or printig errors and for the exactness, completeness and topicality of the information provided on the website of the company. The information and data provided on the Paroteq website may be altered at any time without prior announcement. They are provided by Paroteq without any obligation and exclude any warranty. As far as the Paroteq website contains links or pointers to a third party website, Paroteq does not accept any responsibility for any information, material or link contained in them. We expressly declare that we do not in any case agree with the contents of linking pages. By visiting the Paroteq website you alone take over any risk of damage to your computer, software or data by viruses or other software which is transferred or activated via the Paroteq website or your visit to it. In no case can Paroteq be held responible for any direct, indirect, special, concomitant or subsequent damage or escaped profit resulting from the use or misuse of information or from incomplete information on the Paroteq website.

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How to find us

Contact

Paroteq GmbH
Walter-Kleinow-Ring 7A
1. Etage links
16761 Hennigsdorf (near Berlin)
Germany
Telephone: +49 (0)3302 8982901
Telefax: +49 (0)3303 5488714
E-Mail: info@paroteq.de
Web: www.paroteq.de

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Pick-and-place system with dispenser and heating plate
Pick-and-place system with dispenser and heating plate

Key features H-system
  • beam splitter optics for precise alignment
  • fully programmable Z-axis
  • compact design
HFB-System
Pick-and-place system with high force capability

Key features HFB-system
  • adjustable bond force up to 1000N
  • levelable and height adjustable stage
  • network ready
Heating plate and heated pick-up tool
Heated pick-up tool

Key features heated pick-up tool
  • up to 50k/s
  • up to 450°C
  • coplanarity adjustment
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